Fine-pitch packages reward process control and punish guesswork. Our SMT line uses 3D solder-paste inspection, controlled reflow profiles and AOI before boards move to test.
Package and process range
| Parameter | Capability |
|---|---|
| Passives | 0201 and above |
| Fine-pitch ICs | QFN, QFP, DFN, CSP down to 0.2 mm pitch |
| BGA | BGA, uBGA, LGA and PoP; X-ray inspection standard on BGA builds |
| Connectors | Fine-pitch board-to-board, FPC and press-fit on request |
| Board size | 50 x 50 mm to 500 x 500 mm |
| Sides | Single or double-sided reflow |
| Stencil | Laser-cut stainless steel, step stencils for mixed paste volumes |
| Inspection | 3D SPI, AOI, X-ray, visual and cross-section |
The SMT flow
- Solder-paste printing with 3D SPI feedback.
- Pick-and-place with verified feeders and component traceability.
- Reflow under a recorded profile matched to the paste and board thermal mass.
- AOI for placement, polarity and solder-joint defects.
- X-ray on BGA, LGA and other hidden-joint packages.
- Through-hole, rework and conformal coating as required.
BGA and rework
BGA builds are inspected by X-ray for bridging, voiding and missing spheres. When rework is needed, we use a controlled reflow profile, remove residual solder, reball where required and re-inspect. Every rework event is recorded against the serial number or board reference.
Have a mixed-technology board with fine-pitch BGA and through-hole connectors? Send the assembly drawing and we will confirm the process sequence before quoting.
Frequently asked questions
Can you place parts on both sides?
Yes. Double-sided reflow is routine; the second side is profiled so previously placed components are not disturbed.
Do you inspect every BGA by X-ray?
Yes, BGA and other hidden-joint packages are X-rayed as part of the standard inspection plan.
What about moisture-sensitive parts?
MSL parts are baked or dry-packed according to their floor life, and the bake/usage record is kept with the build.