Quick-turn PCB fabrication & assembly for North America 24-hour quote turnaround
postmaster@fesstek.com Shipping DDP to the US & Canada

Capabilities

Rigid, flex, rigid-flex, HDI, aluminium and heavy-copper constructions, from 1 to 40 layers.

From 1 to 40 layers

Match the board to the application

Every construction below can be paired with SMT assembly, inspection and DDP delivery. If your design sits between two categories, send it over — we will confirm the process window before quoting.

At a glance

Standard process window

Typical values for quick-turn and production orders. Tolerances outside this window are reviewed case by case.

ParameterCapability
Layer count1–40 layers (sequential lamination up to 40)
Base materialsFR-4, high-Tg FR-4, Rogers, PTFE, aluminium, heavy copper
Board thickness0.2 mm – 6.0 mm
Copper weight0.5 oz – 20 oz (heavy copper on request)
Minimum trace / space3 / 3 mil (HDI); 4 / 4 mil standard
Minimum drill0.15 mm mechanical; 0.075 mm laser microvia
Surface finishesENIG, ENEPIG, HASL-LF, OSP, immersion silver, immersion tin, hard gold
Solder mask / legendLPI in green, black, blue, red, white, matte black; white legend standard
Impedance control±10% standard, ±5% on request with test coupons
InspectionAOI, X-ray, flying probe, ICT, FCT, cross-section, FAI

Have Gerber and BOM ready?

Send them now — we will reply with pricing, lead time and DFM notes within 24 hours.

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