When routing density and pin count outgrow a standard board, HDI buys you space without sacrificing signal integrity. We build multilayer and HDI boards up to 40 layers with controlled impedance.
Multilayer and HDI range
| Parameter | Capability |
|---|---|
| Layer count | 4-40 layers; HDI 1+N+1 through 3+N+3 |
| Minimum trace / space | 3 / 3 mil |
| Microvia | Laser-drilled 0.075 mm and above |
| Via structures | Through, blind, buried, stacked and staggered microvias |
| Impedance control | ±10% standard, ±5% with coupons |
| Materials | FR-4, high-Tg, Rogers, Megtron-class high-speed laminate |
| Copper fill / via fill | Epoxy or copper-filled via-in-pad on request |
| Surface finish | ENIG, ENEPIG, OSP, immersion silver |
Why HDI
HDI replaces through-holes with laser microvias and finer routing, freeing space for high pin-count packages and shrinking the board. It also improves electrical performance: shorter via stubs, tighter impedance control and better return paths for high-speed signals. The trade-off is process complexity, so HDI designs need a stack-up review before release.
- Fine-pitch packagesCSP, PoP and 0.4 mm pitch BGA benefit from via-in-pad and laser microvias.
- High-speed routingControlled impedance and shorter stubs reduce reflections and crosstalk.
- Space-constrained productsWearables, modules and dense control boards fit in smaller enclosures.
- Sequential laminationMultiple lamination cycles build the blind/buried via stack reliably.
Send your stack-up and BGA pitch early. We will confirm whether 1+N+1, 2+N+2 or 3+N+3 is the most cost-effective way to break out your design.
Frequently asked questions
How many HDI lamination cycles can you build?
Up to three sequential lamination cycles (3+N+3) depending on the stack-up and via structure.
Can you fill vias for via-in-pad?
Yes. Epoxy or copper fill with planarization is available; specify the requirement in your fab notes.
Is HDI suitable for prototypes?
Yes. Small HDI panels are built regularly for prototypes; the main cost driver is the number of lamination cycles.