The inspection plan should match the failure modes that matter for your product. We agree the plan at quote stage so there are no surprises at shipment.
Inspection methods
| Parameter | Capability |
|---|---|
| 3D SPI | Solder paste volume, height and alignment before reflow |
| AOI | Placement, polarity, solder joints, lifted leads and tombstones |
| X-ray | BGA, LGA, QFN and other hidden-joint packages; voiding and bridging |
| Visual inspection | Workmanship to IPC-A-610 Class 2 or 3, magnification as required |
| Cross-section | Plating thickness, barrel integrity and solder-joint geometry |
| Flying probe / fixture | Netlist continuity and isolation on bare boards and assemblies |
| Functional test | Power-up, firmware and application-specific behavior |
Matching inspection to risk
A low-risk prototype may need only AOI and electrical test. A medical or automotive board may need SPI, X-ray, cross-sections, FAI and functional test with records retained. The right plan is the one that catches the failure modes your product cannot tolerate — not the longest list of checks.
- PrototypeAOI, electrical test, visual inspection, photos of any rework.
- Pilot / productionAOI, X-ray on hidden joints, ICT or FCT, first-article report.
- High reliabilitySPI, X-ray, cross-sections, impedance coupons, FAI and lot traceability.
Need a specific inspection record for a customer or regulator? Tell us the format at quote stage so the data is captured during the build, not reconstructed afterward.
Frequently asked questions
Do you X-ray every BGA?
Yes, BGA and other hidden-joint packages are X-rayed as part of the standard plan.
Can I get photos of my boards before shipment?
Yes. We can send inspection photos and first-article images with the shipment or by email.
What is the difference between AOI and visual inspection?
AOI uses cameras and software to check every joint against a programmed model; visual inspection is a human workmanship check, often on a sample or at final inspection.