BGA Assembly

**BGA Assembly Services with Advanced X-Ray Inspection at FeSS Technology Limited**  

Since our inception, FeSS Technology Limited has been at the forefront of BGA assembly, offering comprehensive solutions including BGA rework and reballing services. Equipped with state-of-the-art BGA placement systems, precision assembly processes, cutting-edge X-Ray inspection technology, and fully customizable turnkey PCB assembly services, we are your trusted partner for high-quality, high-yield BGA boards.

**Unmatched BGA Assembly Capabilities**  

With years of expertise, we handle a wide range of BGA types, from micro BGAs (2mm x 3mm) to large-scale BGAs (up to 45mm), including DSBGA and other complex components. Our advanced capabilities allow us to place BGAs with pitches as fine as 0.4mm, ensuring your designs are brought to life with precision.

**Optimized BGA Assembly Process & Thermal Profiling**  

Thermal management is critical in BGA assembly, and at FeSS, we leave nothing to chance. Our production team conducts a thorough **DFM (Design for Manufacturability) Check**, analyzing your PCB files and BGA datasheets to develop a customized thermal profile tailored to your project. Key considerations include:  

- **BGA Size**: Optimized heating to prevent joint voids and ensure uniform soldering.  

- **Ball Material Composition**: Specialized profiles for leaded and lead-free BGAs to avoid defects like open balls or pin shorts.  

- **IPC Compliance**: Adherence to IPC Class II or Class III standards, ensuring voids are less than 25% of the solder ball diameter.  

During our DFM review, we also evaluate PCB laminate compatibility, surface finish effects, maximum warpage tolerance, and solder mask clearance—all critical factors for flawless BGA assembly.

**BGA Soldering, Rework & Reballing Services**  

Whether your project involves a few BGAs for R&D prototyping or complex fine-pitch components, FeSS has you covered. Our specialized BGA soldering services are ideal for testing and evaluation, while our affordable BGA rework and reballing services ensure your boards remain functional and reliable. Our rework process includes:  

1. **Component Removal**: Safe and precise extraction of damaged or faulty BGAs.  

2. **Site Preparation**: Cleaning and preparing the PCB for reassembly.  

3. **Solder Paste Application**: Precise deposition for optimal soldering.  

4. **BGA Replacement**: Accurate placement of new or reballed BGAs.  

5. **Reflow Soldering**: Controlled thermal profiling for flawless joints.  

We guarantee 100% functionality for all boards returned to you.

**Advanced X-Ray Inspection for BGA Assembly**  

Quality is non-negotiable at FeSS. Our advanced X-Ray inspection systems detect and eliminate soldering defects such as:  

- **Solder Balling**  

- **Paste Bridging**  

- **Cold Solder Joints**  

- **Via Integrity Issues** (e.g., broken vias in pad, blind/buried vias)  

Using 2D X-Ray imaging and 3D rendering, our technicians perform quantitative analysis to ensure compliance with IPC standards. Our proprietary software calculates ball gap sizes, providing actionable data to optimize assembly quality.

**Why Choose FeSS for BGA Assembly?**  

1. **Cutting-Edge Technology**: Advanced equipment for precision and reliability.  

2. **Expertise You Can Trust**: Years of experience in complex BGA assembly.  

3. **End-to-End Solutions**: From prototyping to production, we’ve got you covered.  

4. **Rigorous Quality Control**: Multiple inspection stages for defect-free results.  

**Get Started Today**  

Ready to elevate your BGA assembly project? Contact FeSS Technology Limited to discuss your requirements or request a quote. Email your PCB design files and specifications to sales@fess-tech.com, and let us deliver the precision and quality your designs deserve.