SMT Assembly

**Surface Mount Technology (SMT) Assembly at FeSS Technology Limited**  

At FeSS Technology Limited, we are a trusted leader in high-speed, precision SMT assembly, delivering complete PCB assembly solutions to clients across diverse industries. With over a decade of expertise in SMT design assembly, we take pride in every aspect of our service—from unparalleled assembly quality to rapid turnaround times as fast as 24 hours. Our team of highly trained PCB specialists is dedicated to providing client-focused support, ensuring you stay informed at every stage of your project. Here’s an in-depth look at our SMT assembly capabilities.

We specialize in both **SMT Prototype PCB Assembly** and **Low- to Mid-Volume Production**, utilizing a combination of automated and manual assembly processes. Whether your design requires single- or double-sided placement, we have the technology and expertise to handle it seamlessly. With FeSS, you can focus on innovation while we manage the intricacies of production.

**Our SMT Assembly Capabilities Include:**  

- **Advanced Package Types**: BGA, QFN, SOIC, PLCC, QFP, UBGA/DSBGA, POP, and more.  

- **Fine-Pitch Components**: We support pitches as small as 0.2mm (8 mils).  

- **Miniature Passive Components**: Capable of handling chip packages down to 0201 size.  

- **Through-Hole Technology (THT)**: Seamlessly integrated with SMT for hybrid designs.  

- **Free Passive Components**: For our full turnkey clients, we offer a selection of passive parts from our extensive inventory.  

**Your Design, Our Priority**  

At FeSS, we tailor our PCB assembly process to align with your design requirements and constraints, ensuring flawless SMT soldering every time. During our complimentary **DFM (Design for Manufacturing) Check**, we review your SMT PCB design and provide actionable recommendations to optimize manufacturability. However, you remain in full control of your project, and we collaborate closely with your engineering team to deliver the exact SMT assemblies you need.

We meticulously adhere to the reflow soldering specifications of each SMD component, leveraging precise thermal profiling and process controls to achieve exceptional yields. To guarantee the highest quality, we employ a multi-tiered inspection approach, including:  

- **Visual Inspections**: Conducted at multiple stages to catch defects early.  

- **Automated Optical Inspection (AOI)**: For rapid, accurate detection of placement and soldering issues.  

- **3D X-Ray Inspection**: Essential for leadless packages like QFN, DFN, and BGA, where visual inspection is impossible.  

**Your Partner in Every Stage**  

No matter where you are in the design process, FeSS is here to support you. From initial concept to final production, we offer:  

- **Early-Stage DFM Guidance**: Optimize your design for manufacturability from the start.  

- **Rapid Prototyping**: Fast turnaround times to accelerate your development cycle.  

- **Flexible Production Runs**: Scalable solutions tailored to your volume needs.  

- **Instant Online Quotes**: Use our intuitive calculator to estimate assembly costs in minutes.  

**Why Choose FeSS for SMT Assembly?**  

1. **State-of-the-Art Equipment**: Our advanced SMT lines ensure precision and repeatability.  

2. **Industry-Leading Expertise**: Over 10 years of experience in complex SMT assembly.  

3. **Quality Assurance**: Rigorous inspections and process controls for defect-free results.  

4. **Client-Centric Approach**: Transparent communication and tailored solutions.  

**Get Started Today**  

Ready to bring your SMT designs to life? Contact FeSS Technology Limited to discuss your project or request a quote. With our commitment to quality, speed, and collaboration, we’re here to make your vision a reality.