Advanced PCB


HDI Technology



**HDI PCB Manufacturing at FeSS Technology Limited**  

At FeSS Technology Limited, we have continuously advanced our manufacturing capabilities to meet the growing demand for High-Density Interconnect (HDI) PCBs. Since enhancing our facilities in 2016, we have proudly offered comprehensive HDI PCB fabrication and assembly services, delivering cutting-edge solutions for the most complex designs.

 

HDI PCBs are characterized by their superior wiring and pad connection density compared to traditional PCBs. With finer traces, closer spacing, smaller capture pads, and micro-vias, HDI technology is essential for modern electronics that demand lightweight, compact, and high-performance circuit boards. As consumer electronics continue to shrink in size while requiring higher speeds and lower signal loss, HDI PCBs have become a cornerstone of innovation.

 

**Industries We Serve**  

Our HDI PCB manufacturing expertise supports a wide range of industries, including:  

- **Automotive**: Engine control units, GPS systems, and dashboard electronics.  

- **Computing**: Laptops, tablets, wearable devices, and IoT solutions.  

- **Communications**: Mobile phones, modules, routers, and switches.  

- **Digital Devices**: Cameras, audio equipment, and video systems.  

 

**HDI PCB Capabilities**  

FeSS Technology Limited is equipped with state-of-the-art facilities to deliver advanced HDI PCB solutions. Our capabilities include:  

- **Blind and Buried Vias**: Including micro-vias for high-density designs.  

- **NCVF (Non-Conductive Via Fill)**: Ensuring reliable connections.  

- **Copper Fill**: Enhancing thermal and electrical performance.  

- **Sequential Lamination**: Supporting complex multilayer designs.  

- **3/3 Trace/Space**: Precision manufacturing for ultra-fine features.  

- **5% Impedance Control**: Guaranteeing signal integrity.  

 

We currently produce sequential lamination boards with up to **40 layers**, utilizing advanced laser drilling machines capable of creating holes as small as **0.002 inches (2 mil)**. Our HDI technology enables inner and outer layers with **3/3 trace/space** and exceptional registration accuracy. Additionally, we maintain a vast inventory of raw materials, including North American and exotic options, to meet your specific requirements.

 

**HDI Technology Matrix**  

- **Laser Drilling**: 0.002"  

- **Copper Pad Size**: 0.008"  

- **Micro-Vias**: Up to 8 layers  

- **Smallest BGA**: 0.40 mm  

- **Trace/Space**: 0.003"/0.003"  

- **Impedance Control**: ±5%  

 

**Commitment to Innovation**  

At FeSS, we are dedicated to pushing the boundaries of HDI PCB manufacturing. Our ongoing investments in technology and processes aim to deliver even greater capabilities, such as:  

- **Megatron 4 and 6 Materials**: For enhanced performance.  

- **Sub-5% Impedance Testing**: Ensuring precision in high-speed designs.  

- **Wire Bonding**: Supporting advanced packaging solutions.  

- **Ultra-Fine Trace/Space**: Below 0.003" for next-generation applications.  

 

**Specialized HDI Solutions**  

We specialize in a variety of HDI technologies, including:  

- **1/4 oz and 3/8 oz Copper Foils**: Tailored to your design needs.  

- **Back Drilling and Controlled Depth Drilling**: For high-frequency applications.  

- **Press-Fit Holes**: Tight tolerances for reliable connections.  

- **Ultra-Thin Cores**: As thin as 0.001" for compact designs.  

- **Buried Capacitance (BC) Cores**: Improving signal integrity and reducing noise.  

- **Dual Surface Finishes**: Customizable options for enhanced performance.  

- **Multi-Color Solder Mask & Silkscreen**: For improved aesthetics and functionality.  

- **Gold Fingers and Hybrid Builds**: Meeting diverse application requirements.  

 

**Your Partner in HDI PCB Manufacturing**  

FeSS Technology Limited is your trusted partner for high-quality HDI PCB solutions. Whether you’re developing prototypes or scaling up production, our team is here to support your success. Contact us today to discuss your project requirements or request a quote. Let us help you bring your innovative designs to life with precision and reliability.


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Add: RM 2209, 22/F, 655 NATHAN ROAD, MONG KOK HONG KONG

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