Our Services

PCB Assembly Services

FeSS Technology Limited offers **full and partial Turn-Key PCB assembly solutions**, including **rigid PCB assembly** an···

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PCB Fabrication Services

FeSS Technology Limited delivers professional printed circuit board manufacturing with **consistent high quality** and *···

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Component Procurement

FeSS Technology Limited operates a streamlined **component sourcing system** to support affordable PCB assembly. Our exp···

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ADVANTAGE

Time-Optimized Workflow

Integrated circuits have two main advantages for discrete transistors: cost and performance. The low cost is due to the ···

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Cost Reduction

After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and ···

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DFM & DFA Validation

Integrated circuits manufactured on the surface of semiconductor chips are also known as thin film integrated circuits. ···

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About Us



Since its founding in 2015, FeSS Technology Limited has established itself as a leader in **prototype and small-to-medium volume turnkey PCB manufacturing services**,earning an outstanding reputation in the electronics manufacturing industry.Core StrengthsIntegrated Production Ecosystem:Our facilities combine an **international supply chain**, dedicated component procurement teams, and state-of-the-art PCB assembly lines, optimizing costs while deliveringagile responsiveness to client demands.Fu...

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Services

2025-03-20

IC Programming Services

**IC Programming Services at FeSS Technology Limited** At FeSS Technology Limited, we offer comprehensive IC programming services as part of our state-of-the-art PCB assembly solutions. To ensure maxi···

2025-03-20

Parts Management

Parts ManagementFeSS Technology Limited has a well-developed and efficient component sourcing system for low-cost PCB assembly. We have a professional team with years of expertise in managing the purc···

2025-03-20

HDI Technology

**HDI PCB Manufacturing at FeSS Technology Limited** At FeSS Technology Limited, we have continuously advanced our manufacturing capabilities to meet the growing demand for High-Density Interconnect (···

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